Electronics Forum | Fri Aug 20 11:24:54 EDT 1999 | Chuck B.
I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. Can any one tell me what I have to change in my SMT process (paste, reflow, etc) If any? I ran one P.C.Board and I
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv
Electronics Forum | Mon Nov 27 21:29:57 EST 2006 | davef
Chemical gold is a poorly defined [very sloppy] term that means various thing to different people [as you've demonstrated]. Commonly it is either: * ENIG: 5�m Ni, 0.1�m Au * Immersion gold "Autocatalytic chemical gold plating" - Refers to "electrol
Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Thu Aug 25 17:24:44 EDT 2016 | davef
Gold should not be corroding in salt water. I have swum hundreds of miles in salt water with my wedding ring on my finger. My ring is a shiny and corrosion-free as the day it was cast over 120 years ago. It's possible that your gold thickness of 0.0
Electronics Forum | Fri Aug 11 14:50:35 EDT 2000 | Doug Philbrick
Any Motorlla Guru's out ther know, or can say, if Mot is mandating a change away from Gold / Nickel and going to OSP where BGA are involved?
Electronics Forum | Tue Aug 21 22:24:36 EDT 2001 | davef
Root around here http://www.kns.com/resources/library/lib-wirebonding.asp
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Thu Dec 12 06:38:31 EST 2002 | Roni H.
I need to know basic details about Imersion Tin technology (what is the process, electroless? direct over Cu or over difusion barrier?....). More important is - Does anyone have experience with it? I'll be glad to hear some feedbacks from the "field"