Electronics Forum: electromigration (Page 2 of 6)

Electrical failures

Electronics Forum | Mon Feb 25 16:08:14 EST 2008 | fsw

All, I am of the opinion that electromigration is very different from dendrite formation. Is it different or one & the same. Anyone have any feedback on this?

What is the preffered spacing between PTH and SMT pads

Electronics Forum | Wed Apr 29 04:57:08 EDT 2009 | davepick

It depends on the application what will be considered the biggest issue to avoid (production or longterm reliability). Tin Whiskers are bit of an unknown quantity - but a more realistic problem could be dendritic growth / electromigration forming sho

Electromigration Testing

Electronics Forum | Sun Jun 27 10:48:46 EDT 2004 | crios

I am a Quality Engineer which went from an Automotive QS9000 company manufacturing ceramic hybrid boards and now I am with a ISO PC mfg. company dealing with PCBA boards. I've been assigned a task in determining the contributing factor to high contam

Flux residue

Electronics Forum | Fri Jul 31 09:12:35 EDT 2009 | gregoryyork

Dear Sean Contrary to believe MOST formulators of No Clean fluxes or No Residue fluxes use organic acides that are in fact weak and benign. IF the residue was left on the board and you had a condensing atmosphere then you may see some issue with fal

Electromigration Test

Electronics Forum | Wed May 12 11:02:00 EDT 2010 | eugene123

Hope every one are in good condition. I am Eugene, QA Engineer from Singapore, I been assigned to perform a electromigration test for the test coupon that consist 96 test point. Test condition: 85 deg C, 88% RH and 50V DC Measure Condition: 100V DC a

changing from no-clean to clean

Electronics Forum | Fri May 17 14:23:34 EDT 2002 | dason_c

I will convinced to change to the no clean process by environmental safe even though clean process is water soluble but it still produce the waste. Also, the BGA is not recommend to clean, if the flux is not completed removed from the board and elec

Flux residue?

Electronics Forum | Thu May 01 18:37:31 EDT 2003 | gregoryyork

Did you get any dulling of the solder joints at all or importantly was the resist discoloured or bleached after cleaning. It is possible to absorb flux and saponifier into the resist and this will definately cause poor SIR or electromigration especia

Electromigration Testing

Electronics Forum | Thu Jul 01 10:24:31 EDT 2004 | davef

There is no specification for �Ion Chromatography for Ionic Cleanliness�. The performance of your product in your customer use environment determines the level that you select. The good part for you is that have at least one pole that you can put i

Fog Test

Electronics Forum | Fri Jul 26 17:02:07 EDT 2002 | davef

Never heard of flux residues forming a lense. The first thing that comes mind when thinking about your 'fog test' is: Ionic Contamination While this seems pretty far afield from your interest in optical effects, I'll continue briefly. A reverse

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Thu Dec 12 13:53:01 EST 2002 | gregoryyork

Considering only Ionic residues is very dangerous, most heat transfer fluids that are extremely hygroscopic are also non ionic especially those used in HASL / Roller Tinning fluids. Also consider if the resist is cured or in fact porous which absorbs


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