Technical Library | 2014-01-09 16:40:33.0
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk. This paper summarizes the selection of resistor embedded materials, evaluations of resistive material (Phase 1) and duplication of a complex digital design (Phase 2). Phase 1 –resistive materials (Foil 25Ω/sq NiCr and 1kΩ/sq CrSiO) and resistive-Ply materials (25Ω/sq and 250Ω/sq NiP) were chosen for evaluation.
#Module Thyristor Type:Snubberless Peak Repetitive Off-State Voltage Vdrm:600V On State RMS Current, IT(rms):12A Gate Trigger Current (QI), Igt:35mA Gate Trigger Current Max, Igt:35mA - Global Electronic Components Distributor Supply of electronic
Industry News | 2018-09-06 15:18:14.0
Although many High Q capacitors are available on the market, performance can vary widely depending on design and quality of manufacturing
Industry News | 2010-04-12 15:30:49.0
IPC APEX Expo Conference and Exhibition, Las Vegas – Design engineers in the electronics industry who are seeking ways to improve power integrity and reduce electromagnetic interference (EMI) while meeting halogen-free requirements now have a new solution to meet their needs. The 3M Electronic Solutions Division now offers halogen-free* versions of its Embedded Capacitance Material (ECM).
New Equipment | Assembly Services
Layers 2-64L Plate Thiickness 0.6-10mm Minimum mechanical aperture 0.2mm Minimum laser aperture 4mil HDI Type 1+n+1、2+n+2、3+n+3 Minimum line width & spacing 4/4mil
New Equipment | Assembly Services
Layers 2-64L Plate Thiickness 0.6-10mm Minimum mechanical aperture 0.2mm Minimum laser aperture 4mil HDI Type 1+n+1、2+n+2、3+n+3 Minimum line width & spacing 4/4mil
New Equipment | Assembly Services
Layers 2-64L Plate Thiickness 0.6-10mm Minimum mechanical aperture 0.2mm Minimum laser aperture 4mil HDI Type 1+n+1、2+n+2、3+n+3 Minimum line width & spacing 4/4mil
Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the po
Industry Directory | Manufacturer / Manufacturer's Representative
CORECHIPS is an industry-leading independent electronic components distributor with cost-saving and reliable supply chain ,serving global customers with one-stop sourcing solution
Technical Library | 2018-12-05 14:52:23.0
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of material and process changes such as the shift from precious metal electrode (PME) configurations which were predominantly silver/palladium to base metal electrodes (BME) dominated by nickel. Each of these changes were accompanied by both quality and reliability problems. The MLCC industry is now in the midst of an unprecedented set of challenges similar to the Moore’s Law challenges being faced by the semiconductor industry. While capacitor failures have historically been responsible for a significant percentage of product field failures (most estimates are ~30%) we are seeing disturbing developments in the low voltage (
