Electronics Forum: engineered and conductive and materials (Page 2 of 4)

Differences between screen and stencil printing

Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon

Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)

need for an old design and BOM

Electronics Forum | Tue May 30 08:07:56 EDT 2000 | David Lazarus

I am a senior industrial engineering student at the University of South Florida. For my Facility Design class, my team has chosen to design a PCA plant that will make one product. We are looking for an obsolete or in-service circuit board assembly

and you think youve got it hard

Electronics Forum | Wed Jul 05 10:54:26 EDT 2006 | slaine

In the last couple of weeks ive been working with a new mechanical design engineer, i knew things were going to be difficult when i caught him putting a trial through a reflow oven using loctight thread lock to hold a smd led in place. but today i ha

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia

Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But

SMT termination visual and solderability issues.

Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling

CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function

Touch-up and inspection of visual defects

Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel

Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only

Process control, SMT inspection and rework

Electronics Forum | Tue Apr 09 21:40:26 EDT 2002 | ianchan

We are a local enterprise with limited resources, just like you described, so hope this experience sharing helps : we place a production Visual Mechanical Inspection (VMI) inspector at the end of each Reflow Oven area, complete with magnify scope 30

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:00:12 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil


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