Electronics Forum | Wed Jun 11 11:33:07 EDT 2003 | tt
We have been looking around at all of the various BGA visual inspection systems, (i.e. ERSAscopes like contraptions). It seems like the number of different manufacturer's of these types of systems has exploded in the past couple of years, and it lo
Electronics Forum | Wed Jul 09 15:54:51 EDT 2003 | Louis
I need advice from someone who has already soldered this part or similar fine-pitch BGA with metal heatsink on top Should I solder it in the oven or it's better with a rework station (IR 550A Ersascope) Thanks All
Electronics Forum | Fri Jul 16 15:01:31 EDT 2004 | waveroom
I cant wait to hear the replies. We are an Ersascope dealer. Have sold over 25 systems. Have looked at all the competitors and Fortunately in our minds, Ersa still offers the best system. Not the least expensive, but the best. I found that ease of
Electronics Forum | Sun Oct 31 09:19:26 EST 2004 | Steve
I believe on High Temp. Spheres you require paste eutectic 63/37. The solder paste forms an intermettalic bond to the pad and a bond to the surface structure of the high temp sphere. The standard 63/37 alloy spheres will melt during reflow and form t
Electronics Forum | Wed May 18 04:59:26 EDT 2005 | Rob
There is a reasonably cheap tool called an Ersascope some of our customers swear by. The link is: http://www.ersa.de/en/ You don't get all the issues with radioactive sources then either. Never personally used it as we had xray, but I've heard a l
Electronics Forum | Sun Jun 12 19:22:52 EDT 2005 | techknow..
When examining a Bga using an Ersascope, I found that all the joints where good. However I found that the first few solder balls from left to right ( vice versa ) seem higher than the middle solder balls. It appears that the body of the part is flex
Electronics Forum | Wed Mar 14 16:23:01 EDT 2007 | J
I am not sure Ersascope and X-Ray will tell you the results you are looking for. My experience with x-ray has proven that misalignment, voids, and bridging are really the only failures that can confidently be observed. You may have solder in place,
Electronics Forum | Fri Apr 20 01:42:37 EDT 2012 | thmeier
If you extend the pads you get the effect that the solder below the component is pushed to the outside land which results in a very low standoff of the component, deteriorate the overall quality of the solder joint. Hot air (pencil or some of the sem
Electronics Forum | Mon Jan 07 20:31:15 EST 2002 | davef
While not a Motorola 860 BGA user, we see that on other components. In fact, some of the ErsaScope adverts show the effect. WHAT CAUSES THIS? Generally, the design / layout of the interposer has been the cause of this appearance. IS THIS A CONCER
Electronics Forum | Tue Oct 21 23:28:59 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
