Used SMT Equipment | Assembly Accessories
we need Besi Die Bond: Type: Datacon 2200 Evo 8800FC ,2200 APM+
Used SMT Equipment | Semiconductor & Solar
Besi #DC8800FC Quantum High Speed Flip Chip Bonder Offline Curing Machine w/Datacon #Etx 1.1 Port Controls, Scanner, Power Supply: 3/N/PE/208/220/240/400 VAC, 50/60Hz, (Serial#: 950 8874 3355) Auction will be on April 3, 2018 at 11 AM Online Throug
Used SMT Equipment | Screen Printers
2021 ESE US-2000X Screen Printer MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 21102496 PCB Size: 50 x 50 ~ 550 x 400mm DOM: October 2021 Power: 220v, 1p/2w , 50/60hz, 15A PCB Thickness: 0.1mm ~ 5mm Cycle Time