Electronics Forum | Mon May 15 05:17:18 EDT 2006 | Rob
Hi Patrick, Sorry, wrote it in a hurry on Friday afternoon, I meant show us evidence of a scientific trial on all or at least some other alloys. I accept Tin whiskers and other similar phenomina exist, I even accept that the whole ROHS directive
Electronics Forum | Wed Sep 10 14:56:57 EDT 2008 | rarnold
I am dealing with a similar uncoalesced solder issue. This defect has come and gone several times during the last 6 months. See image. In my case, I am using conventional SnPb solder and an entire strip of my OSP finished board (includes various de
Electronics Forum | Thu Jun 27 17:32:35 EDT 2013 | tpost
We recently had a question come up regarding the amount of solder on a flat underside termination ( we referenced Flat Lug Lead in IPC 610). Judging by the photo you can see on the Left is a target solder joint, but on the right is one which had rewo
Electronics Forum | Wed Oct 18 06:49:37 EDT 2000 | stefano bolleri
Dave, who told you not to wave solder? Is it your initiative, just to stay on the safe side, or did somebody provide evidence/recommendation? How could I contact this somebody? Is there any report/datasheet/white paper that you know of? Thx, SB
Electronics Forum | Wed Mar 21 20:07:26 EST 2001 | mparker
Now that more of the root cause is evident, that which set your frustration in the first place, maybe the answer is READY, SHOOT, FLOG 'EM!!!
Electronics Forum | Sat Jul 27 14:30:56 EDT 2002 | Juan C. Ruiz
Do you have any picture or reference how can we determine black pad or plating contamination. I have heard about a lot of problems regarding BGA's and normally these components are only replaced or heat it and that's it ,after that the boards are wor
Electronics Forum | Thu Mar 27 11:11:00 EST 2003 | blnorman
We've evaluated the Rheopump. Problems we've found are 1) cycle time differences between forward and backward print (evidently the pump charges pressure on one and not the other), 2) excessive amounts of paste left in the tubes (roughly 60 grams we
Electronics Forum | Mon Feb 16 16:23:32 EST 2004 | blnorman
We tried Ionox BC in our MPM, but evidently a feed line came loose allowing the Ionox to spray, flood, whatever on the inside of the machine. The Ionox ate through some of the insulation on the wires. As long as it stayed in the plumbing, it worked
Electronics Forum | Tue Mar 09 17:52:05 EST 2004 | davef
Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BGA balls. * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temp
Electronics Forum | Thu Jul 15 13:58:12 EDT 2004 | stevecrowley
Got the Gui and Rt to talk finally. It was as simple as receding the boards. Evidently they can move in the edge connectors. Thanks all.
