Electronics Forum | Wed Aug 15 01:30:56 EDT 2007 | wayne_
To be more specific. I am actually talking about the electrical fatigue whereby a unit is undergo a cyclic electric test. Unlike thermal fatigue, it is all talking about temperature related testing, eg, ageing test, thermal cycle test, etc. Anyone of
Electronics Forum | Mon May 12 15:08:53 EDT 2014 | davef
I've never used SAC405. Not for nothing ... Other low temperature solder alloys that you should consider are: * Sn42/Bi58 [138*C]: Alloy for low temperature applications. Attention should be paid to potential embrittlement issues and poor thermal fa
Electronics Forum | Mon Aug 27 15:03:40 EDT 2001 | davef
Essentially, you want to ruggedize this component. Various adhesives could work great, depending on the source of the energy that is causing the solder connection fatigue. So, what are your looking to: * Rigidly bond the component to the board? * A
Electronics Forum | Tue May 27 17:39:37 EDT 2003 | ghenning
Can anyone add any new info to this old thread? We be great if a study was available detailing expected performance and factors that can have an impact like complexity, fatigue, etc. Lots of AOI mfrs claiming that there are studies on this but noone
Electronics Forum | Sat Feb 02 09:33:33 EST 2002 | davef
�8.4.2, Cracking Of Soldered Joints in the epic "Soldering In Electronics" by RJ Klein Wassink [Electrochemical Publications,ISBN 0 901150 24 X] covers cracking differented by: * Overloading * Creep * Fatigue You can't go wrong by starting there.
Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill
What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.
Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen
I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Sun Apr 03 10:07:40 EDT 2005 | davef
In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and columns, in space applications for the European Space Agency. One clear result was that amount of solder paste printed on the solder lands is very critic
Electronics Forum | Mon Mar 31 14:24:58 EDT 2008 | Mr. Sexy Specs
My Company has instituted a new policy making it mandatory to wear Safety Glasses on the shop floor. Many of my inspectors are complaining that they have suffering from eye fatigue as a result of the new glasses. Has anyone done any tests to see if A
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