Electronics Forum: filling (Page 2 of 97)

Accidental solder mask

Electronics Forum | Wed Dec 18 09:04:29 EST 2002 | russ

Dave, You stated that an unfilled via is of greater strength than a filled or partially filled via. I posted to another thread recently and I stated that a filled via was of greater strength than an unfilled. I was tought (incorrectly?) that a fill

Immersion Gold (ENIG)

Electronics Forum | Sun Sep 18 07:54:17 EDT 2005 | davef

hole fill

Wire to board soldering

Electronics Forum | Tue Jun 20 21:30:05 EDT 2006 | davef

The minimum vertical hole fill is defined as follows: Class 1: Not specified, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side. Cl

Supported holes, Solder, Vertical Fills, Hidden under connector body

Electronics Forum | Fri Oct 12 12:12:13 EDT 2018 | davidsmullins

We have some fairly standard 0.1" pitch, two row, shrouded, through hole headers soldered onto a thick backplane. There are tiny inspection holes along the bottom edge of the plastic body that allow an inspector to observe the top of the through hole

Trying to solder on the solder destination to fill PTHs. Does any IPC standard have requirements for this?

Electronics Forum | Fri Nov 30 12:21:26 EST 2018 | davef

Three things ... 1. Since you are soldering a component over a hole that limits the possibility that the hole could be filled with solder, it makes me wonder if the hole is supposed to be filled with solder. What do the engineering notes say? 2. Ta

idle machine time

Electronics Forum | Wed Apr 05 13:00:27 EDT 2000 | mike d

Hi guys, Anyone have any good ideas on how to fill up idle surface mount machine time? We are currently between projects and have idle time which I need to fill. Any good tips would be greatly appreciated. Thanks, Mike D.

High Aspect Ratio Via Fills

Electronics Forum | Fri Apr 05 11:18:20 EST 2002 | habs24

Anyone have experience using Dupont CB100 for high aspect ratio via fills? Or even where I could get more information on the processes involved? Thanks in advance...

CSP Process

Electronics Forum | Wed Oct 23 09:41:49 EDT 2002 | Antonio

Can anyone give me a ran down process on CSP? Is it like BGA process that needs reflow? what oven do I need...vapor, nitrogen or convection? is under fill a necessity? when and why do i have to under fill? when not to underfill and why? etc.... than

conductive fill via

Electronics Forum | Mon Nov 11 02:28:27 EST 2002 | Melvin

I want to make a double-sided PCB. the process include conductive filling via for RF guarding. Does anyone can tell me where I can do it?

Accidental solder mask

Electronics Forum | Wed Dec 18 08:38:17 EST 2002 | davef

Thanks Tim. Additional thoughts are: * We've talked here on SMTnet about hole fill previously. * That your ability to get hole fill is probably limited by mask in the hole makes us very uneasy, because hole could have varying levels of solder mask i


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