Electronics Forum | Wed Oct 29 03:39:31 EDT 2008 | milas
Thanks for the feedback dave. What kind of problems am I liely to face if I was to stick it out with my current specification ?
Electronics Forum | Sat Nov 01 11:08:47 EDT 2008 | vladig
In addition to what Dave has said, you shouldn't worry much about having too much (too thick) of Au, as it's a self-limiting process. So Gold embrittlement isn't an issue. Regards, Vlad
Electronics Forum | Mon Nov 03 14:50:08 EST 2008 | dphilbrick
One other note, NEVER have an ENIG board fabricated by a house that "farms out" the gold. This always ends in disaster! Make sure whoever you choose does the whole process.
Electronics Forum | Thu Jan 29 16:48:49 EST 2009 | slthomas
Looks like a time/temperature problem to me. However, there are a lot of solder fines surrounding the pads in one photo that go beyond what I'd expect from inadequate TAL. Is it possible that the board was misprinted and not completely cleaned, or
Electronics Forum | Tue Oct 28 19:47:05 EDT 2008 | davef
Your gold might be a bit thin after you consider fabricator's tolerance. IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended specification is
Electronics Forum | Wed Aug 04 16:49:24 EDT 2004 | jim_bob
Regarding Lead Free component finishes, vendors are zeroing in on matte tin plating as the finish of choice. What test are performed, to determine if a finish is "matte" type (vs. non-matte)?
Electronics Forum | Thu Jan 29 20:57:06 EST 2009 | padawanlinuxero
HI!!! its a ERSA Reflow Oven HotFLOW 7 and I really appreciate some help thanks
Electronics Forum | Wed Jan 24 11:27:54 EST 2007 | bradlanger
We have been using SN100C lead free hasl for over a year now with good success. It is very solderable and has good shelf life. You do have to make sure the finish gets applied to the correct thickness. If the lead free hasl finish is not applied thic
Electronics Forum | Thu Jan 29 00:12:39 EST 2009 | grayman
Hi Armando, I think you have to buy a bigger reflow let say 7 zones to get the correct profile. The reason you are getting that problem is due to short profile time. What is the size of your board? What is the composition of your solder paste? Ple
Electronics Forum | Mon Feb 02 09:22:55 EST 2009 | ck_the_flip
Everyone's telling you setpoints, but yet, we haven't seen a thermal profile from you. It'd help if you can provide this, and using everyone's recommended setpoints, determine if your profile is meeting: 1.)Time Above Liquidus 2.) Peak 3.) Ramp
