Electronics Forum | Mon Mar 05 22:42:30 EST 2007 | davef
On your ENIG thickness requirements, search the fine SMTnet Archives for previous discussions, like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=33661 On determining if your board will solder properly: ANSI/J-STD-003, Solderability Te
Electronics Forum | Wed Mar 07 16:44:43 EST 2007 | realchunks
Well there ya go, this proves you can't engineer from your desk, thru a computer, miles away! I'm also surprised you answered back - most don't. Thanks Mark.
Electronics Forum | Sun Mar 11 19:48:17 EDT 2007 | abjason
There is nothing to argue if you had found Ni above or togather with Gold, definitly you got poor wetness and awful solderbility for sure.
Electronics Forum | Thu May 01 09:11:28 EDT 2008 | ck_the_flip
Me too! Last time I evaluated these, voiding was a big problem. I wonder if the technology on these has advanced at all. Look forward to the forum responses (*rolling my eyes like a sarcastic Rodney Dangerfield*)
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Mon Mar 05 16:16:08 EST 2007 | Mark
Hello, We are having issue with one of the customer board. This is 10 layer PCB FR4 with black solder mask. Coating Ni/Au. Soldering leadfree. We are using 7 zones air reflow oven (zones top&bottom). We have bed solder flowing for this boards. T
Electronics Forum | Thu Jul 07 17:59:58 EDT 2005 | russ
I have found that if you place it "upside down" with the paper on the bottom they work very well also. The paper has a tendency to warp during heating which causes the no connects. by adding flux to the preform you are essentially sticking the pref
Electronics Forum | Wed Dec 06 16:17:31 EST 2006 | Mario Scalzo, CSMTPE
Normally, we try to limit the over print of the paste to the width of the pad on both sides. If you are using 500um pad, then I wouldn't try over a 1500um aperture. Mario Scalzo, CSMTPE, Dartmouth 6 Sigma Green Belt Technical Support Engineer - Ind
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
