Electronics Forum: fr-1 (Page 2 of 2)

lead free for multiple reflow process

Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam

We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l

Delamination effect in FR1 type PCB (Lead free soldering)

Electronics Forum | Mon Jan 06 17:37:54 EST 2014 | hegemon

Make sure you are providing an adequate moisture bake out prior to wave soldering. It sounds moisture related since is so random. I would suggest perhaps 120C for a minimum of 8 hours to drive the moisture out, and then complete your wave soldering

Re: Rephrase : mixed technology criteria.

Electronics Forum | Mon Oct 11 13:44:29 EDT 1999 | Dave F

Ken: Since Earl is no longer here, I guess I'll bite on this. Your questions are very broad and difficult to answer specifically. So, I'll give you broad and non-specific answers. | Hi, | | We are using mixed technology in our PCBA. Would like to

Higher TG for PWB when soldering Lead Free (?)

Electronics Forum | Mon Mar 08 19:52:54 EST 2004 | Ken

I have processed the following materials in lead free processes: CEM FR1 FR4-120 FR4-140 FR4-170 Each material has different responses to thermal stresses. Issues to consider are: Panel size, smt only, wave only, double sided smt...and smt / wave

PDBE and PBB replacements???

Electronics Forum | Fri Mar 11 18:47:54 EST 2005 | davef

JD: It's important to note that FR-4 does not contain PBB or PBDE. The bromine in FR-4 epoxy comes in the form of tetra-bromo-bisphenol A [TBBA], which polymerizes and become part of the cross-linked epoxy. Bromine, in the form of hydrogen bromide, i

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