Electronics Forum | Tue Feb 16 12:26:07 EST 1999 | S. Rose
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc |
Electronics Forum | Thu Jun 25 06:02:41 EDT 1998 | Chiakl
Hi there, Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? Appreciated for your help. rgs, chiakl
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Tue May 05 17:01:25 EDT 1998 | bob
I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventuall
Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Thu May 29 14:27:04 EDT 2003 | larryk
This flex is .001" Kapton polyimide. The flex portion of this rigid flex consists of 3 layers of 1 oz copper with 5 layers of Kapton. Part of the flex is sandwiched in standard FR4 with two layer of copper on each side for a finished thickness of .
Electronics Forum | Sun Apr 25 08:46:57 EDT 2004 | Roni H.
Hello, Does anyone heard of "F2" or "GV" as replacement materials for FR4?? I'll be glad to have any information regarding this issue. Thanks Roni H.
Electronics Forum | Mon Mar 07 15:35:35 EST 2005 | John M
It has been my experience that the standard Fr4 material (Tg 135c) will discolor when processed at the new higher temperatures required for the high tin alloys... We have been using the High Tg Fr4 (Tg 170c) for many years to ensure this does not hap
Electronics Forum | Tue May 17 10:01:42 EDT 2005 | russ
I have had the same problem with this supplier, we found that one mfg. place or process used a .015" piece of FR4 as the base while others had .030" Fr4, We discontinued use of the .015" and never had a problem again.
