Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef
IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"
Electronics Forum | Fri Feb 13 16:13:20 EST 2009 | jax
Many shops require levels for typical component packages on FR-4 or a like substrate to be 2, 9, 15, 1 and 10 mg/in2 for fluoride, chloride, bromide, nitrate, and sulfate respectively. These levels can change for Medical or Automotive.
Electronics Forum | Fri Mar 11 18:30:50 EST 2005 | davef
Russ: In December 2003, the European Commission released the following statement: �The commission services have prepared a draft Commission decision establishing maximum concentration values pursuant to Article5(1)(a) of Directive 2002/95/EC. The pr
Electronics Forum | Fri Jul 07 03:27:31 EDT 2006 | dougs
Hi folks, thanks for all the tips. We have run our first batch of these flexi boards now. I had the PCB suppliers make me some 1.6mm FR4 carriers to lay the boards on to carry them through the process. (1 flat & 1 with cutouts for the second side)
Electronics Forum | Tue Aug 14 15:45:06 EDT 2001 | davef
BOARD BAKING SCHEDULE: Bake time depends on the board thickness and construction. For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. ROOT CAUSE OF THE PROBLEM: Heating moisture entrapped between the laminations of the board too quickl
Electronics Forum | Wed Mar 05 03:43:58 EST 2003 | testing
Hi, Mike Thanks for the reply With your oracle system were you able to perfom SPC analysis? and if possible do you have any Material that may be helpful for me to get my system setup i.e. whether through Excel, Access, Oracle etc. + What are your
Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1
Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di
Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian
A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th
Electronics Forum | Thu Dec 10 03:37:29 EST 1998 | Youngho Song
Hi everybody? I heard that typical FR-4 would not acceptable for BGA application. What is the main reason? (thermal property? or CTE?) Sombody please answer me the requirement of PCB substrate for PCB application. Thanks. Youngho Song
