Electronics Forum: fr4 baking (Page 2 of 6)

Re: Baking FR-4 PWB's prior to reflow

Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc

Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a

FR4 vs Polyamide

Electronics Forum | Mon Feb 15 14:28:09 EST 1999 | Andy Bellworthy

Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc

Re: FR4 vs Polyamide

Electronics Forum | Tue Feb 16 12:26:07 EST 1999 | S. Rose

Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc

FR4 vs Polymide

Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry

Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.

Re: FR4 vs Polymide

Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN

Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.

Moisture absorbtion in circuit boards

Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c

I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh

Delamination / Measling

Electronics Forum | Mon Dec 08 17:06:59 EST 2008 | boardhouse

Hi MGL, Couple things to ask, have the boards recently been changed to Rohs builds? STD FR4 to High TD Laminate. Check the stack-up the board houses are using. Just about all Rohs laminate has Resin starvation issues when used in single ply co

Re: Reflow Oven

Electronics Forum | Thu Jun 15 21:51:17 EDT 2000 | Dave F

Jeff: You're correct �7.1.3 of ANSI J-STD-001C states " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles." We don't bake "FR4" for love nor money. The archive are littered with threads along this line.

Delamination / Measling

Electronics Forum | Sat Dec 13 17:46:27 EST 2008 | ysutariya

If you're military then you're probably just needing standard 130Tg FR4 and tin-lead finish. I would check two things: 1. Bake temperature: Isola recommends 300F for 4 hours to drive moisture out. Lower baking temperatures do not require a linea

Warp PCBA- how to repair

Electronics Forum | Sun Jul 15 20:10:09 EDT 2001 | Danial

What is the best method to repair Warped PCBA. Obviuosly twisting it back to make it flat would be a disasterous. The method that I've tried wold be mounting the assembled board to the flat holder with the clamp and bake them at 120 Deg C for about 4


fr4 baking searches for Companies, Equipment, Machines, Suppliers & Information