Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Wed Apr 27 14:10:30 EDT 2005 | Bruno Lalonde
I m looking to implement a maintenance program here at Exfo, I'm looking form the norms on the hand soldering iron (tip to ground resistance and Voltage linking). Thank
Electronics Forum | Wed Apr 27 21:59:34 EDT 2005 | davef
Check with your soldering iron supplier. We'd expect them to say: * Tip to Ground Resistance:
Electronics Forum | Thu Apr 28 08:08:46 EDT 2005 | Bruno Lalonde
Thank for your quick answer, waht to you mean by yammering, I'm sorry my english is not very good
Electronics Forum | Thu Apr 28 09:11:34 EDT 2005 | davef
Don't apologize. Your English is fine. * In Enlish look here: http://www.freesearch.co.uk/dictionary/yammering * In French, maybe: Parler � tort et � travers
Electronics Forum | Mon Jan 26 04:13:48 EST 2004 | patthemack
First of all, did you profile this board with a mole, such as a KIC? Is the solder flowing, or just not wetting to the part or pad? I work with RF boards as well, but the main problem is tombstoning due to the ground plane side being larger because o
Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny
Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro
Electronics Forum | Wed Jan 28 20:26:32 EST 2004 | Vinny
Hi Guys, Really need your help to suggest how to tackle this situation.
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
