Electronics Forum | Thu Nov 18 18:49:24 EST 2004 | Haran
We are looking for a Inspection house in China to perform Inspection and Sorting on PCBA manufacturing process and product at various MNC's. Well verse with IPC requirement.
Electronics Forum | Mon Feb 13 23:05:02 EST 2017 | swestheimer
I have been asked a very good question but have not been able to find a good answer. IPC for both PCB and PCBA refer to the X & Y dimensions to measure warp and twist but how would you determine the warp and twist for a round PCB or PCBA?
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Sat Dec 15 10:36:25 EST 2001 | clarkk
Tried both, with no success. The big guys are pretty secretive about how they do things. The lawyer understands arbitration and things like that, but doesn't have a clue about customer furnished materials or volume pricing. I have found that IPC is w
Electronics Forum | Sat Mar 05 22:57:32 EST 2005 | gpaelmo
This has been our practice and its worked well: SMT process-QC/Touch-Up-Assembly. We have dedicated QC/T-Up after reflow trained under IPC requirements. They do the SMT inspection and ONLY touch-up if necessary. This way we never have to inspect SMT
Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman
Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes
60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept
Electronics Forum | Sat Oct 24 06:07:09 EDT 1998 | Earl Moon
| Hi, | Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. | thanks, | subhash | Most independent PCB test labs, often doing military
Electronics Forum | Mon Oct 26 14:56:07 EST 1998 | carl m
| | Hi, | | Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. | | thanks, | | subhash | | | Most independent PCB test labs, often do
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
