Electronics Forum | Fri Oct 30 12:45:19 EDT 2015 | atekcare
Selective Soldering machine depending on your volume? Happy to help find economical solution for you. Just contact us at alan@atekllc.com or call 720-532-5100 x107
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Wed Feb 09 21:19:03 EST 2005 | Mrduckmann2000
Russ, We can not use a wave pallet, already went that route. We have parts next to the thru-hole pins and between thru-hole pins. I am going to try an experiment in the next day or so with solder mask. I plan to solder SMT parts on the back of se
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Mon Oct 24 05:43:52 EDT 2016 | zxcvb
I have many PCBs that use an AVR in SMD packaging, and since I frequently change the firmware in prototype boards, I'm trying to come with the best solution to program the AVR quickly and easily. The first approach was to have a standard header (2x5
Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris
Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Mon Mar 13 06:11:08 EST 2006 | Rob
Surely this is a job for Wavemaster Larry? Have you tried flux buster pins in your ICT yet? They are quite good at cutting through the crap on a board.
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
