Electronics Forum | Fri Jul 15 10:04:02 EDT 2005 | stepheniii
It depends on what you want to accomplish. I believe DB Cooper wants a better product with less wasted effort. If so then Russ and DaveF are the ones to listen to. If you want to impress managers, customers, and others, then you are doing it right.
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
Electronics Forum | Thu Jun 17 17:04:43 EDT 1999 | Doug Batten
Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembly
Electronics Forum | Tue Apr 14 10:21:11 EDT 1998 | EFData
| Does that part still have a heat sink built into it or is it the plastic package? | Justin Originally, we also thought the heat sink may be causing problems, so we conducted tests on both the plastic package and heat sink versions. Nothing conclusi
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Wed Nov 10 02:20:07 EST 1999 | Marc
The padsfor large heat sinks are being designed on our boards with large copper ground planes surrounding them by our engineers. I am having great difficulty keeping the reflow temperature below 230 degrees in order for the temperature of the copper
Electronics Forum | Thu Jun 24 14:14:25 EDT 1999 | Chris
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Mon Dec 18 09:42:44 EST 2000 | floydl
When designing high performance circuit boards are there methods that can be used to improve thermal conductivity without using heat sinks? Can boards be designed in a way that reduces or eliminates the need for sinks?
Electronics Forum | Mon May 12 14:49:28 EDT 2014 | davef
Hi Evtimov 'hege gave you a plausible explanation for what's going on with solder running-up the lead of your components: TOO MUCH METAL!!! I've got different one. This explanation goes along the way that you're thinking, but just opposite. The rea
