Electronics Forum | Thu Aug 21 15:50:12 EDT 2003 | davef
Couple of points are: * You're technically correct that ball height has the potential to vary by 8 thou, but we never see that much variation. Ball heights within a lot of components vary just about nil. * When we place BGA, we smush them into the p
Electronics Forum | Tue Jan 12 16:16:21 EST 1999 | Sanjay Bhatikar
For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? It appears to me that there are two options: A: to have a pn chart based upon the % of
Electronics Forum | Tue Jan 12 17:56:18 EST 1999 | Jason Hall
| For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | It appears to me that there are two options: | A: to have a pn chart based upon
Electronics Forum | Wed Mar 15 09:01:11 EST 2006 | Vick
The lead was inspected for coplanarity and it's within the specification it's designed for and doesn't show any variation in terms of height as compared to it's adjacent lead that has good wetting
Electronics Forum | Mon Aug 21 10:47:48 EDT 2006 | FredC
Hello Mika, I just checked a windmill and a test nozzle we have on the bench. The useful travel of the nozzle before the risk of the crosspin getting stuck in the loading gate is 1.5mm, if it gets stuck it is the nozzle is 1.7 up. If the cross pin is
Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer
| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard
Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Tue Jan 12 19:07:07 EST 1999 | Earl Moon
| | For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | | | It appears to me that there are two options: | | A: to have a pn chart bas
Electronics Forum | Mon Oct 23 06:50:06 EDT 2017 | spoiltforchoice
For package shapes/names I would recommend using manufacturer names. This is much safer than coming up with descriptive names like QFN32_5x5 as there are multiple 5mm 32Pin QFN shapes even when pitch is the same, this makes it safer to use a name in
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
