Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy
Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve
Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox
Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike
Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman
Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Fri May 17 10:53:15 EDT 2013 | davef
ENEPIG or Imm Pd? Concerns about palladium as a solderability protection are: * Palladium is more difficult to process in fab than gold * Palladium solder alloys can be brittle, similar to gold, without proper soldering process and/or specification/
Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal
Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process
Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1
Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di
Electronics Forum | Mon Mar 06 17:17:13 EST 2000 | gary
I need a little help with RF and Rogers 4003 board material. My background was in digital and now I need to set up a new line to make small RF products (.5" x .5" or smaller). I want to find out about board platings, finishes/maskings and reasonable
Electronics Forum | Mon Mar 06 17:17:13 EST 2000 | gary
I need a little help with RF and Rogers 4003 board material. My background was in digital and now I need to set up a new line to make small RF products (.5" x .5" or smaller). I want to find out about board platings, finishes/maskings and reasonable
Electronics Forum | Fri Jul 15 08:20:44 EDT 2005 | stepheniii
And why do you want to control the process? To prevent defects, I would think. Actually orginally the way I first saw SPC was to reduce inspection. If you are using SPC for plating thickness, you don't have to measure every piece to be confident the
