Electronics Forum: hours of operation (Page 2 of 55)

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach

We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.

Quick Purge of Reflow Oven for N2 Operation

Electronics Forum | Mon Dec 28 12:36:31 EST 1998 | Mark D.

We have a Vitronics SMR400N oven and many times need to use N2 inerting. My problem is that it takes close to an hour of operation to purge the system to achieve the desired O2 levels (~40PPM). This is not only time consuming but results in an inordi

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon

We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg

Re: Quick Purge of Reflow Oven for N2 Operation

Electronics Forum | Mon Jan 04 18:56:25 EST 1999 | Marc P.

We have a Vitronics SMR400N oven and many times need to use N2 inerting. My problem is that it takes close to an hour of operation to purge the system to achieve the desired O2 levels (~40PPM). This is not only time consuming but results in an inor

Re: Catastrophic failure of solid tantalum smt caps

Electronics Forum | Fri Apr 02 02:01:24 EST 1999 | P.L. Sorenson - Technical Consultant

Has anyone heard of a problem with catastrophic failure of large value (200uF) solid tantulum capacitors that have been exsposed to high humdity. I suppose that with water moisture seep in the capacitor, the risk is ver

Reflow soldering of 208-RQFP-0.5mm

Electronics Forum | Mon Oct 31 20:35:58 EST 2005 | milroyperera

If I brief shifting, I checked the component before it enter the reflow oven and saw that the IC is perfectly aligned on the pads but when it comes out from the oven the IC is floated on the pads. The floating is irregular and the IC is shifted away

Fifo of Solder Paste

Electronics Forum | Fri Sep 26 16:49:46 EDT 2008 | janz

what about tube (could be transparent) with opening at the bottom to pick up by operator and loading new fresh jars from top (vertical tower of solder jars). Each time when operator takes jar next one appears on the bottom etc.

Visual Inspection of PCBA

Electronics Forum | Wed Oct 09 13:52:17 EDT 2019 | valletta

Hi Aurther, Thanks for a prompt reply. I agree but unfortunately our AOI is 2D and misses a lot of solder defects especially on connector terminals which are surface mount. We are also dependent on operator at AOI to mark the defect if caught by AOI

Visual Inspection of PCBA

Electronics Forum | Mon Oct 14 12:56:27 EDT 2019 | robl

Thanks. The key things for me are decent text recognition (not just checking pixel patterns), and very good component models to speed up programming and debug. We can run multiple board types per hour through ours. Also be nice if there was a dece

Stacking of Bare Boards

Electronics Forum | Fri Apr 07 10:26:01 EDT 2000 | Ashok Dhawan

I have come across a number of cases where Solder Mask is chipped off or scratched. I was wondering this has anything to do with : **Packing of PCBs in stacks and vacuum sealed **Stacking of PCBs prior to print operation What is general practice i


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