Electronics Forum | Thu May 08 08:07:24 EDT 2008 | tazzntigger
I am with Rwyman. This "hybrid" profile is also used for reworking the BGA's.
Electronics Forum | Fri May 12 07:32:13 EDT 2000 | David Hatherall
Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls. we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommend
Electronics Forum | Tue Jun 30 07:23:47 EDT 1998 | Marjan
I would be very grateful if someone could provide me with recent figures (schemes)of 1. pin through hole assembly 2. hybrid circuit 3. surface mount technology. Or could anyone tell me where I can find such information? Thanks a lot. Marjan.
Electronics Forum | Wed May 19 17:43:25 EDT 2010 | pforister
Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like a BGA. This is a RoHS assembly using no-clean solder (Kester EM907). The voids are at or above 25%. I use an 8 zone oven where I peak in zone 7 and
Electronics Forum | Tue Jun 30 18:40:07 EDT 1998 | Earl Moon
| I would be very grateful if someone could provide me with recent figures (schemes)of | 1. pin through hole assembly | 2. hybrid circuit | 3. surface mount technology. | Or could anyone tell me where I can find such information? | Thanks a lot. | Ma
Electronics Forum | Sat Oct 01 01:04:47 EDT 2005 | ck
I face a problem where the components termination is non lead free but solder alloy is lead free. Thus i am using hybrid reflow profile. The specs for the reflow profile i am using: reflow temp. 120 to 160 deg C; time 90 to 120 sec. As for the pak te
Electronics Forum | Tue Nov 14 03:48:08 EST 2006 | aj
Hi, What is the non-leaded part ? the only real obstacle I have found is when using a Leadfree BGA with PB Paste. We have had to do this in the past - the hybrid profile I used was pretty much the same as normal apart from increasing the peak temp
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
Electronics Forum | Tue Nov 30 18:02:45 EST 2010 | flipit
62/36/2 is used often in thickfilm hybrid circuits where Pd/Ag conductors are used. The idea is that you saturate the joint with the 2% silver and thus help eliminate the leaching of the silver from the hybrid circuit pads or the component. We mix
Electronics Forum | Mon Sep 14 07:02:55 EDT 1998 | Wayne Bracy
Jon: What stimulated this? It's okay to pick on Earl, but explain who is placing .008" pitch. Sounds like the olde hybrid guys? Always looking for cheap equipment to do hi-rel production. Wayne
