Electronics Forum | Wed Dec 01 07:47:57 EST 2004 | jdumont
I have been seeing this with a new BGA we have just started using from IBM. Is this a problem if the solder paste is wetted to the unreflowed BGA balls??? It passed our ESS testing with no problems.... TIA JD
Electronics Forum | Wed Apr 18 11:25:06 EDT 2007 | jdumont
We use 1B73 Acrylic and coat right over an IBM processor which gets a heat sink mounted on top. Never had an issue after 5 years of production. Dont forget to post if you find anything out though.... JD
Electronics Forum | Tue Jun 05 19:41:28 EDT 2007 | golff
We have a Universal 4796L pick and place. The current programming software is the old IBM OS/2. Did anyone upgrade their programming system to a better OS like Windows 2000 or NT?
Electronics Forum | Thu Jun 15 16:28:48 EDT 2017 | davef
You should be searching on RN Wild, not Roger Wild This might be a good starting point https://supplychain.gsfc.nasa.gov/docs/sc2011j.planteb.pacquetteasof1020.pdf
Electronics Forum | Thu Oct 21 14:02:32 EDT 1999 | Ron Costa
We are a contract manufacturer currently building a job with IBM CBGA-255 devices and 20mil QFP's that are close to each other. We use a 6 mil laser cut and electro polished stencil with one to one apertures on the BGA's. The customer is experiencing
Electronics Forum | Sat Mar 18 07:33:34 EST 2000 | Dave F
Jack: Two concerns with column devices: 1 Coplaniarity of the device and the board. 2 Adequate solder that you mentioned, becuase the columns will not be reflowing and you need to cloatthem with solder. You didn't describe your aperture, but even
Electronics Forum | Wed Feb 07 21:57:18 EST 2001 | davef
Is ... Marcio Pavageau, a Brazil native and former executive of IBM Brasil Ltda., has been appointed managing director of Pemstar Brasil Ltda. Pemstar 313535 Technology Dr. NW, Rochester, MN 55901; (507) 288-6720; Management: Al Berning, chairman, p
Electronics Forum | Thu Apr 29 09:02:02 EDT 1999 | Frank Boyko
| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. If anyone can it will be IBM. Call Voya Markovitch at 607-757-1335 (Endicott, NY). He is a technical
Electronics Forum | Mon Oct 15 11:03:24 EDT 2001 | mikecampbell
Dave, Thanks for the info! Yes, I have read the IBM document and realized that I was missinformed about the paste volume. I need 5000 to 5600 cubic mils of paste. Running the numbers I get a 32 mil aperture with a 7 mil step (the rest of the board
Electronics Forum | Tue Jan 07 17:58:11 EST 2003 | davef
The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 200
