Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing
Nitril gloves,PVC gloves,Latex gloves One-off molding, no seam design, scarcely generates particles. Disposable nitril glove,latex glove, PVC glove can apply in clean room that up to class 100 or calss1000. Wear comfortable, soft feeling and
Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Henkel's Technomelt products are engineering hotmelt adhesives for industrial applications in various market segments. Henkel's renowned TECHNOMELT low pressure molding solution is delivering superior sealing adhesion and excellent temperature and
The system is an optimal solution for hot glue applications. Hot melt, a thermoplastic adhesive perfectly changes its solid state to liquid when passing through the zones of increasing temperature; an ideal application for the electronic industry, e.
New Equipment | Surface Finish
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications. The StratoSPHERE plasma system is ideal for wafer pro
Industry News | 2009-06-08 23:31:02.0
COLORADO SPRINGS, CO � June 2009 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces the availability of the PORTA-VAC II with wafer tip VMWT-C, capable of handling up to 8" (200 mm) wafers.
