Electronics Forum | Sun Jun 01 03:42:49 EDT 2014 | sync40
Hello to everybody in this forum, I would like to know any information that you kindly may have about the following subject: We very often do manual soldering assembly of immersion tin finished PCBs. Since thiourea is used in the formulation of the
Electronics Forum | Sun Jun 01 13:50:12 EDT 2014 | sync40
Thank you for your reply davef. Although the US restriction, I think that there are plenty of users of immersion tin in Americas, mainly low-volume fabs that do not plan to outsource finishing, or do not plan or can not invest in a HASL. If we res
Electronics Forum | Mon Jun 02 15:09:10 EDT 2014 | davef
I've never heard of anyone affected by thiourea during assembly soldering operations. I believe the greatest concern of exposure to thiourea is during the board fabrication process. BR ... davef
Electronics Forum | Mon Jun 02 20:38:42 EDT 2014 | davef
I believe that you get better responses when you start a new thread, but that's just an opinion, not a rule. BR ... davef
Electronics Forum | Mon Jun 02 15:51:17 EDT 2014 | sync40
Thank you so much again davef for your new reply. This past weekend I was looking for more information regarding this subject, but, as you stated there is no information about thioruea concerns during assembly soldering operations, mainly focused in
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
Electronics Forum | Mon Nov 25 15:55:32 EST 2002 | davef
Sorry, no tricks for you. The good news is: your reflow recipe should be similar for both imm tin and HASL. Imm tin requires more attention to detail by both the fabricator and the assembler than HASL. There is a fair amount of discussion on imm
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Mon Nov 25 16:12:52 EST 2002 | russ
there is a good article by AIM solder regarding tin. In a nut shell, if you do not apply flux or heat to tin finish you will never degrade it! I agree with the others that you need to check the thickness of the pure tin layer. We have forbidden ti
Electronics Forum | Thu Dec 21 20:09:01 EST 2000 | Dave F
You are one lucky person to have access to the fine SMTnet Archives. They have over a hundred threads on immersion tin, white tin, and the other variants.
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