Electronics Forum | Thu Mar 06 11:36:37 EST 2003 | O' Connor
Hi, I'm experiencing a problem on a standard part made many times before -Ni/Au finish PCB, Reflow 100% SMD parts. After reflow the gold on the pads does not fully fuse with the solder paste it remains intact on the extremities of the pads, it seems
Electronics Forum | Thu Mar 06 11:50:22 EST 2003 | John O'Donnell
Greetings Sir, Although I am not qualified to address the issue in detail, I do know first hand that you can obtain very comprehensive and accurate solutions and explanations from George Westby, Director, Universal Instruments Advanced Technology and
Electronics Forum | Fri Mar 07 05:36:21 EST 2003 | O' Connor
Hi Again, In answer to DaveF - Yes solder is fine where the solder paste is deposited , but the part of the pad visible after pasting is still visible after reflow. Previously the solder paste & all the gold diffused & flowed giving a complete silve
Electronics Forum | Sat Mar 08 21:31:17 EST 2003 | MA/NY DDave
Hi Yes DavidF I agree, and that is what I think I am reading in the orginal and follow on post from the poster. I think this problem is just below full failure to solder which was your point, I think. You, and I particularly, are taking opposing y
Electronics Forum | Tue Mar 11 13:35:04 EST 2003 | MA/NY DDave
Hey Neat, We share some of the same books, although I would strongly recommend he expand his collection. That Flex book is only one, the most pricey one, of many on that technology. JUST Kidding THANKS!! If we started listing all our magazine, te
Electronics Forum | Wed Mar 12 16:04:24 EST 2003 | O' Connor
Everybody thanks for all your help, the problem has been solved. Before I describe the solution I've got to own up, I'm the PCB Design Eng., The Process Eng. lobbed this problem onto my desk last week, said the problem lay with the PCB finish, whats
Electronics Forum | Wed Mar 12 17:53:52 EST 2003 | davef
O' Connor Haaa. It's usually the design guys that foist the problems onto my desk. Now that is one shrewd process type that you have working at your company!!!! Can I have his / her name and number to get some tips on the technique that he / she
Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef
O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there
Electronics Forum | Mon Apr 26 14:04:59 EDT 1999 | Steve Gregory
Hi Murray! Justin pretty much summed things up...covered all the points. So I'm just gonna give you my preference of what I like other than HASL finish. Electroless Nickle/Immersion Gold...nice flat pads...hmmmmmmm, Steve likes flat pads. OSP's hav
Electronics Forum | Fri Mar 07 10:51:58 EST 2003 | MA/NY DDave
Hi O'Conner, I hope you also tell us what Universal-GeorgeW discusses with you. It is a little strange seeing his name on this list and his phone number. Gee I can give you his email address but won't.. Again distance engineering is tough. I woul
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