Electronics Forum | Tue Sep 07 06:32:32 EDT 2004 | C Lampron
Dhanashekar, Yes this is an important proces control tool. This will show if you printer setup is correct however, I put more importance on coverage. If your paste height is 1 mil shorter than it should be, you may need to look at your printer setup
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Tue Oct 21 11:42:04 EDT 2008 | arosario
Hi Shooter, we're not using AOI but we do every 30 minutes sampling Inspection on the board and we're not seeing insufficient paste deposit so far since we started. But I agree with you that seemed my printer is not printing consistent amount of pa
Electronics Forum | Sat Jul 28 03:05:35 EDT 2001 | Frank
Hi guy Does anyone have experiance with printing problem between solder paste water soluble 62/36/2 and gold plating PCB? I do have problem about insufficient solder after printing although I used the same printing parameter as when I print with ano
Electronics Forum | Thu Dec 08 19:14:38 EST 2005 | khp_armin
We are encountering insufficient solder paste. Our stencil thickness is 0.13 mm and our printing pressure is 0.08 MPa our solder paste is Tamura TLF-204-19A. Please advice how to solve this problem.
Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22
Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.
Electronics Forum | Thu Dec 08 22:56:07 EST 2005 | davef
Questions are: * Is the stencil design proper to provide the correct amount of solder paste? * Is the stencil design proper to provide for release of solder paste? * Is solder paste filling the stencil aperatures, prior to separation? * Are stencil a
Electronics Forum | Fri Feb 21 19:41:25 EST 2003 | neil
I have had a look at what Bob Willis say's and the answer to my problem is not there. The paste we are using has a very high viscosity and I beleive that if we reduce the metal content to less than 90% it will solve the problem. The problem is parti
Electronics Forum | Thu Feb 18 21:20:13 EST 1999 | Ernie Flamont
During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location on
Electronics Forum | Mon Mar 24 23:56:26 EST 2003 | Dreamsniper
Can anyone who has DEK Horizon's 2D Advance Package System explain how does this below feature works? "Automatically triggered recovery sequences" Does it mean that operator need not be there to press any button to clean and recover a print if the
