Electronics Forum | Thu May 11 12:44:04 EDT 2006 | slthomas
One of our customers' products has a couple of adjacent 0603 packages (one resistor, one cap) that are .010" apart. They are side by side, not end to end. The adjacent pads between the two parts are electrically connected so bridging isn't an issu
Electronics Forum | Tue Apr 05 16:20:49 EDT 2011 | cvoyles
I work with a small EMS shop that has extremely good capability because I created it for an R&D Lab for the U.S. Army. We have at times discussed leasing the equipment/facility to other companies who prefer that to farming out their work to an EMS.
Electronics Forum | Fri Oct 27 10:54:19 EDT 2017 | sumote
Might i suggest reading the IPC-610-F (or any recent revision). Even if you are not going to build to it, you should get some idea of what your product should look like and some basic requirements. A good experienced SMT Engineer sounds like a good
Electronics Forum | Mon Oct 13 12:28:11 EDT 2003 | Andrea
Up until this point, my company has been hand soldering all of our assemblies. We are a high reliability manufacturer and work to the IPC-610 Class three/ target. We just received a Reflow Solder Batch Oven. It is a small oven, a Gold-Flow GF-B. I ha
Electronics Forum | Thu Feb 05 14:30:29 EST 2015 | chsravan
Can I apply IPC-610 class 3 workmanship standards to an assembly made with a IPC-600 class 2 PCB?
Electronics Forum | Mon Jul 24 07:18:51 EDT 2017 | jamesbarnhart
IPC has updated assembly standards for IPC A-610 and IPC JSTD-001 making them easier to use and adding information in areas that have evolved. Both IPC J-STD-001E and IPC-A-610E have also been more closely linked to eliminating the differences that c
Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef
James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Wed Apr 10 17:43:40 EDT 2019 | davef
Here's the table of contents for IPC-A-610G: http://www.ipc.org/TOC/IPC-A-610G.pdf
Electronics Forum | Mon Feb 25 13:12:20 EST 2008 | bschreiber
Hello CarlN, Yes, StencilScan can reverse engineer a stencil, screen or a board. We just take a high resolution scan of the stencil/screen/board and the software does the rest. Another cool feature is the Assembly Module option for producing assem
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