Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea
| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin
Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.
| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
Electronics Forum | Tue May 06 21:35:27 EDT 2014 | davef
Indium recommendations: 0201's: * Stencil Opening = 11mil x 16mil rectangle * Foot Print = 12mil x 15mil rectangle * Stencil Thickness = 5mils * Spacing = 9mils Note: The most common stencil being utilized, is the laser cut electropolished, and in so
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Fri May 29 05:43:05 EDT 2020 | ameenullakhan
Hi Team, what we have observed is that tension basically at the center of the stencil is less . And it directly depends on the number of aperture opening we have . More the opening less the tension. But there is no supporting document for the same
Electronics Forum | Sun Sep 11 05:48:32 EDT 2005 | Mika
If 0 or 180 degr. make v-shape openings to each other left & riht, if 90 or 270 degr. top/ bottom, on the stencil apertures; well, you understand... We use this and 87 % reduction of stencil apertures for 0603:s and 0402:s. 0.127 mm stencil thicknes
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
.gif)
