Electronics Forum | Wed Mar 11 17:32:46 EDT 2015 | jlawson
Small paste deposits have less flux thus less flux activity to enhance the wetting. So preheat needs to be as short as possible, ramp to spike if possible. Try not to ramp hold and spike - pending thermal delta on product can be made to ramp to spike
Electronics Forum | Tue Apr 14 20:28:03 EDT 2015 | carlosdugay123
Hello Marshall, I represent Metal Etch Services, we manufacture SMT Single and Multi-Level Stencils, we have over 25 years experience and one of the reasons most of our customers like us is because we offer technical assistance. Regarding the issue y
Electronics Forum | Fri Jun 29 14:15:00 EDT 2001 | stefo
This is a question about complying with J-STD-001 solderability testing. Do any of you have your vendors certify that the components and PCB's that you buy from them comply with the solderabilty requirements spelled out in the -002 and -003, in lieu
Electronics Forum | Fri Nov 25 09:27:09 EST 2011 | fjtxra
Dear All, I´m looking for a low temp solder paste with Lead. I know that, with lead free, is common solder paste with bismuth for low temp in Pin in Paste line, but one customer aks me about low temp solder paste with lead. If anybody knows about and
Electronics Forum | Fri Nov 25 14:52:50 EST 2011 | davef
Sn43/Pb43/Bi14 is a low temperature leaded alloy that has been used with very good success. The low melting point helps avoid some thermal shock issues on some assemblies. A word of caution, this alloy forms a low melting point at approximately 95*C.
Electronics Forum | Tue Mar 09 23:34:35 EST 1999 | Clarissa Ortner
We are starting up an SMT line with a printer and convection oven.... The area we are considering for the printer is totally uncontrolled for humidity, temperature and even cleanliness. We are working on the filters to keep particulates down, but I
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Electronics Forum | Tue Jun 22 17:14:41 EDT 1999 | Dennis Fall
I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substrae)
Electronics Forum | Fri Aug 29 07:22:05 EDT 2008 | realchunks
Omid, Try changing your profile. I had the exact same thing happen to me in 2006. Eventually I had to change my paste. No lead parts can and DO have a different finish that Pb parts. Why do you think the rest of the world increased their oven te
Electronics Forum | Mon Jul 01 19:43:44 EDT 2013 | kumar_antom
Hi there, Its a lead free process and the paste that we're using is with this alloy composition : Sn,Ag,Cu,Bi,In.... Pls refer to the attached temp.profile.... This is a mirror Pcb....Same components on both A and B side.... A side doesn't have t
.gif)
