Electronics Forum | Tue Nov 09 13:20:21 EST 1999 | Dave F
Chuck: Try: 1 WWW.JEDEC.ORG 2 Search "surface mount package" which gives you ... MO-Index INDEX OF MO OUTLINES IN PUBLICATION NO. 95 BY-FAMILY INDEX OF REGISTERED MICROELECTRONIC (MO) OUTLINES (contains description of the content of each file) Goo
Electronics Forum | Mon Jul 29 21:41:22 EDT 2002 | davef
Rite. Moisture, not N2, in the air is the issue.
Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW
If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap
Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt
Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek
The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5
Try baking the boards; you may have a moisture problem.
Electronics Forum | Mon Dec 29 09:10:22 EST 2008 | stepheniii
It takes time for the moisture to penetrate into the body. I think the 5 years of ambient would be more the culprit than washing the boards. Especially since you are baking them after wash. Get a few of the ICs and put them loose on a board and put
Electronics Forum | Fri Jan 02 08:10:18 EST 2009 | childs
Thanks for the reply Stephen. The time factor sounds logical for moisture invasion during cleaning, probably why there's no articles showing concern about the process. I did try experimenting with some samples and believe it or not could not dupli
