Electronics Forum | Tue Jun 13 08:17:06 EDT 2006 | davef
The solder alloy does not change based on the flux. Your potential for embrittlement is the same [providing the metal of the solders are the same] with either solder. We would guess the OA flux is [and drag tinning are] removing corrosion from the
Electronics Forum | Wed Oct 04 11:39:26 EDT 2006 | SteveH
Thanks Dave. We are UK based which is why we are still allowed to use Trike and our product is for an aerospace application so changing a cleaning chemical is much easier than requalifying a new flux. This was pretty much what I thought my options
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Mon Oct 02 10:22:13 EDT 2006 | SteveH
We are having issues with cleaning underneath leadless chip carriers due to their extreme low lying nature and I wondered if anyone else had any experience of this. Our process for years has been vapour degreasing with Triklone N, which works, but w
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Fri Dec 17 18:24:39 EST 1999 | Clarissa L. Ortner
We have a new program that is going to require us to add many leads to presently leadless parts. It isn't preferred by we are up against the wall. We will be doing mostly passive caps, resistors and diodes and some LCC's as well. Is there any one
Electronics Forum | Wed Oct 14 04:01:28 EDT 1998 | Joakim Fagerlund
We have problems with achiveing a void free soldered joint when we seal different kind of packages (QFP,LCC and PGA) We think the problem partly is due to outgasing from the die-adhesive (silver-glass) Does anybody have any reccomendations what to d
Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng
janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa
Electronics Forum | Mon Oct 02 20:10:27 EDT 2006 | davef
Choices are: * Buying a helmet. * Using a paste with low residue flux. Where are you located that you can use Triklone N [1,1,2-trichloroethene, CAS No: 79-01-6, C2HCl3]? As a solvent replacement for Triklone, several companies offer proprietary bl
