Electronics Forum | Tue Apr 13 23:08:56 EDT 1999 | Jeff Sanchez
| | | Netters, | | | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | | | 1. Kester 293 no clean | | | 2. 2.1 C/s for 30s to 150 C | | | 3.
Electronics Forum | Thu Aug 22 23:09:34 EDT 2019 | sssamw
Yes, you need work with supplier to see if can run pin in paste for these connectors, even do some experiments. A step-up stencil would be good for these connectors, also connectors pin size and length match with PCB hole design.
Electronics Forum | Wed Dec 15 15:24:22 EST 2004 | russ
I think they need to go after the real lead contaminants. PCB/electronic waste accounts for .01% of lead waste based upon my last info I rec'd. So this lead free agenda is really going to help alot isn't it. I believe that most of the lead contami
Electronics Forum | Tue Jun 19 12:26:38 EDT 2007 | billr73
We will be hand soldering a small number of PCBs per week (both through hole and SMT) using a water soluble flux. We will be using both standard leaded and lead free solder. The completed assemblies be hand washed in a sink using hot water. Do we
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Thu Aug 22 16:25:18 EDT 2019 | scotceltic
Yes, unfortunately a lot of datasheets these days do not contain the temperature resistance to determine if it can handle the PIP application. In the past I have always used a 250 C at a min of 5 sec for the material. Also, the part should have sta
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Tue Feb 16 13:30:20 EST 2010 | asksmt
Hi, I have specified Lead Free Plating for my Four Layer PCB. but the Final Production Solder Process is not Lead free it is leaded Process. My question is will there be an issue if we use Lead free plating on PCB and use leaded solder material fo
Electronics Forum | Wed Feb 01 03:38:56 EST 2006 | Jose Luis
Hi all, I'm working in Military Production and then, We have an exception about RoHS (LEAD FREE), but, because we use "normal" components, in this moments, a lot of components have LEAD FREE terminations, and we think that after of 1st July, we wo'nt
Electronics Forum | Thu May 01 15:42:53 EDT 2008 | ck_the_flip
Yes, the authors do give the caveat that small amount of lead contamination in a SAC/Lead-Free system is tolerated provided the Pb-BGA has sufficiently reflowed. This verbiage is on the bottom of Figure 10. For my own peace-of-mind, I would send yo
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