Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Wed May 25 18:33:18 EDT 2005 | russ
We have passed testing using this process, I would consider it on a case by case basis however. We are very careful about the quantity of the O.A. that we use. The water soluble flux is gone after cleaning unless it was/could be encapsulated or tra
Electronics Forum | Wed May 25 18:09:47 EDT 2005 | Fluxed_State_of mind
Need some input here..... The fear is that the if we use water soluble flux at the repair operation, that the no-clean encapsulation will capture some of the organic material as it cools down and goes to its original state. The organic material wil
Electronics Forum | Fri May 27 12:09:59 EDT 2005 | saragorcos
You do want to be very careful with potentially entrapped organic materials as they are prone to causing electrical leakage failures particularly around sensitive devices. There is a new clenliness testing tool available that tests a localized area
Electronics Forum | Fri Jun 04 11:54:22 EDT 2021 | cbart
We do this quote often with our older Summit machine. there are a few ways to do this. all of these are assuming you have parts on the boards already and are working around them. 1- if you have a good tech that can add solder to the pads on the PCB a
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Thu Apr 05 03:19:04 EDT 2018 | myke03o
We are currently in a Clean solder process (SMT+Wave Solder+Washing). Now our management is planning to convert to a No-Clean process in SMT due to limitations of solder availability and reduction of washing process. Question1: Is it possible to was
Electronics Forum | Mon Dec 29 23:35:42 EST 2014 | abhilash4788
Dear All, I'm just a budding engineer in EMS field. Here we used to manufacture different classes of PCBA. I would like to know about different process that need to be considered while manufacturing class 3 product. If we are going for microscopic
Electronics Forum | jandon |
Sat Jan 10 05:48:09 EST 2015
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
