Electronics Forum | Tue May 29 13:15:13 EDT 2007 | brulal1
Hi everyone you are upgrading our line, we already have and MSR HD 15 from Panasonic, we want to add and Advantis AX-72 form Universal. Panapro sotware don't have the option for the Advantis Ax72, so for now we have to used both software Panapro to g
Electronics Forum | Wed Jun 20 11:39:56 EDT 2007 | realchunks
That's like asking the IRS to do your taxes for ya. Once they're in your building, they will not leave until they go thru top to bottom. Remember, EPA Field Investigators are "supposed" to find things wrong. They may not find any thing wrong with
Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Thu Jan 21 20:22:02 EST 1999 | Earl Moon
| | Hello, | | | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, an
Electronics Forum | Mon Sep 11 20:32:19 EDT 2017 | danielgigavis
Our company is seeking partnerships to venture out to oversea markets. Need representatives/agents to promote our AOI tools to PCB makers. If you are interested please contact me at dl787@gigavis.com, my name is Daniel Lee. www.gigavis.com
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Thu Mar 25 20:09:35 EDT 2021 | grahamcooper22
What is the QFP pitch ? What aperture dimensions have you chosen ? Is the stencil laser cut then polished ? Your AFTER stencil size looks promising...your BEFORE stencil aperture size looks disastrous...would surely give bridges.. Your pcb pad siz
Electronics Forum | Tue Nov 12 17:11:32 EST 2013 | mondalaci
Hi Folks, I'm working on a LED display that is composed of multiple layers. What is interesting for the point of this discussion is the PCB layer and the light deflector layer on top of it. Please take a look at the related pictures at http://plus
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