Electronics Forum | Thu Jun 13 08:32:24 EDT 2013 | rway
Have you verified the measurements on the bench with an LCR meter? Chances are you are experiencing aging with these ceramic caps. We have similar issues with X5R and X7R caps. You will see the effects of aging with returns from the field as well
Electronics Forum | Fri Jul 29 13:42:38 EDT 2016 | gregp
The standard you need is EIA-481B. It details the taping of components from 8mm tape up to 200mm tape including component orientations. 8, 12, 16 and 24mm tape has the sprocket holes only on one side so it is easy to determine the proper orientatio
Electronics Forum | Sat Jul 23 18:16:31 EDT 2016 | ttheis
This information is normally available in the component's data sheet (typically toward the end where the packaging is detailed.)
Electronics Forum | Sat Jul 23 09:19:17 EDT 2016 | dalpets
I want to place smd's by hand from tape strips using a vacuum pump. What is the orientation of polarised smd components on reels/tapes? Is there a standard manufacturing orientation, or are there variations? I understand some manufactures have part
Electronics Forum | Tue Nov 20 12:31:12 EST 2007 | kelz
In my past experience, having via's under or attached to SMD lands produces risk. Solder will not consistently wick the same if it is being drawn into a via. This has also caused issues from solder wetting through the via to the other side causing a
Electronics Forum | Tue Nov 13 09:36:18 EST 2007 | rgduval
From a manufacturing standpoint, this isn't very nice. Vias will tend to wick solder away from the pad, resulting in insuficient solder joints, which require touch-up. The amount of times any solder joint is reheated should be minimized, as extra h
Electronics Forum | Fri Nov 23 15:46:06 EST 2007 | mika
Question: We have an issue right know on a prototype batch with via in the pad on an very small pcb 50x50mm (in a panel of course). The designer has no room to move the vias as they said. The pcb is to packed with components also 8-layers. It is also
Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef
There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio
Electronics Forum | Mon Jul 25 09:11:25 EDT 2016 | spoiltforchoice
There 2 main rival standards for orientation in tape and because you can't really trust manufacturers to stick to one or the other or something else entirely it is always wise to check the datasheet. Typically an SOIC will have pin 1 the same end as
Electronics Forum | Fri Jan 11 06:38:58 EST 2019 | tirthkar8980
what is the standard for pad size of SMD chip type components
