Electronics Forum: measling (Page 2 of 3)

Re: Measling

Electronics Forum | Thu Oct 15 14:23:31 EDT 1998 | Earl Moon

| I have a problem with measling on our PCB's. We saw it on our FR4 PCB's at final assembly yesterday. Is this a defect from the board vendor or something we did in our assembly process when building the PCA's (thru hole). Could the wave solder ma

Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler

We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.

Excessive dwell time in solder fountain

Electronics Forum | Mon May 03 11:20:43 EDT 2010 | mikesewell

A good guideline is keep it similar to your wave solder process, for example 2-3 sec. This assumes you're preheating the assembly. While polyimide boards are fairly robust at some point you will begin to see copper dissolution - the solder side pad

Press fit parts help

Electronics Forum | Tue Oct 14 09:17:09 EDT 2014 | rgduval

You could check the data sheets/web sites from the manufacturers of the press-fit parts. They typically will identify the recommended tooling/equipment necessary to install their components. Generally, pneumatic presses are suggested, with controll

Re: Baking PWB's

Electronics Forum | Mon May 24 10:45:04 EDT 1999 | John Thorup

| Can anyone help me with the correct baking cycle for removing moisture for PWB's. These are 10 layer double sided SMT. | | Thank You R. J. Klein Wassink in Soldering in Electronics states - 16 hours @ 105C or 40 hours @ 80C in a ventilated oven

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef

There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si

Delamination / Measling

Electronics Forum | Sat Dec 13 17:46:27 EST 2008 | ysutariya

If you're military then you're probably just needing standard 130Tg FR4 and tin-lead finish. I would check two things: 1. Bake temperature: Isola recommends 300F for 4 hours to drive moisture out. Lower baking temperatures do not require a linea

Crazing or Delam - Thermal or Mechanical?

Electronics Forum | Fri Jun 19 07:28:56 EDT 2009 | mhunter

Thank you for your responses Davef and Boardhouse. The material used is Iteq Corporation IT-180. I performed more testing yesterday and found the following: I could insert Berg Pins into the assembly at various locations or a Pem. None of these

AOI inspection of DNI locations

Electronics Forum | Mon Feb 02 03:23:26 EST 2015 | alexeis

Hi, Most of our customers perform DNI check. Some of them give a special focus on the issue when it is a new product (NPI) or change version (ECO/ECN). Our customers perform tests on AOI machine and feed the results into a software tool called TopoQ

Delamination / Measling

Electronics Forum | Mon Dec 08 17:06:59 EST 2008 | boardhouse

Hi MGL, Couple things to ask, have the boards recently been changed to Rohs builds? STD FR4 to High TD Laminate. Check the stack-up the board houses are using. Just about all Rohs laminate has Resin starvation issues when used in single ply co


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