Electronics Forum | Fri Mar 31 12:27:27 EST 2006 | Marcus
We have used the SN100C for over a year now with fanastic results. We use the SAC305 for SMT and SN100C wire exclusively. There are no problem mixing the alloys. I am also on the commitee for the NASA testing. The SN100C did out perform SAC and SnPb
Electronics Forum | Mon Oct 06 18:41:47 EDT 2003 | davef
In addition to our earlier comments, do not be misled into thinking that silicone materials, being rubbery, will transmit shock less. Nothing is farther from the truth. Many silicone rubbers are almost totally incompressible in the short time scale.
Electronics Forum | Thu Dec 22 21:29:05 EST 2005 | davef
Josh: Room Temperature Vulcanizing (RTV) is Dow Corning's trade name for it's family of silicone cure sealants. RTV is about the worst kind of coating there is. Its chemistry is highly ionic and it requires atmospheric humidity absorbed to "complete
Electronics Forum | Tue Oct 26 13:40:47 EDT 2004 | Paul_pmd
Have the SOIC tested by independant. Clarify as to weather or not you have run this board before. Check to see if the board has been rev'ed. Sometimes IC's are rated at a clock speed or by axcess time. Engneering on this board may be at the tolorance
Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon
| | | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be
Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Mon Jul 12 14:30:37 EDT 1999 | Earl Moon
| Hi all , | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | 1. Is underfill required for micro-BGAs? | | 2. What type of stencil apertures are the industry standards for uB
Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh
| | Hi all , | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | 1. Is underfill required for micro-BGAs? | | | | 2. What type of stencil apertures are the industry st
Electronics Forum | Fri Dec 13 10:23:55 EST 2002 | davef
Bright ideas??? Bright ideas!!! I got bright ideas. In order of decreasing luminosity: * Stop installing the socket, solder the PLCC to the board, dip the board. The socket is a waste of time and money. You never replace the PLCC in the field, a
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
