Electronics Forum | Mon Nov 12 09:37:17 EST 2007 | russ
You need to perform process a capability study prior to putting these controls into place. Cleaning a stencil after each pass will get ugly, solvent residues remaining in apertures etc. 2D inspection is good. Change paste every hour will get very
Electronics Forum | Tue Jul 11 12:59:26 EDT 2006 | mattkehoe@sipad.com
We are trying to apply solder to boards with 80 microinches of electro plated hard gold. No components involved, just print 63/37 paste and reflow. The results are very poor on some boards, not so bad on others? Pictures at http://www.sipad.net/thick
Electronics Forum | Fri Jun 09 12:13:11 EDT 2006 | Chunks
Rob and Pete are both right. "We" had the same problem, with just one manufacturer of the same style QFP (don't want to name names here). We had the same style of QFP from a different manufacture right next to the problematic one on about 3 product
Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory
| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Thu May 28 09:23:59 EDT 1998 | Chrys
| Hello, | | I need some users information about "hot air knife" after the wave | bath: | - Defects reduction ? | - In what kind of boards(TH/SMT SOICS ect.) it is applied ? | - Where can I purchase it as a retrofit (Soltec Delta 6622cc) ? |
Electronics Forum | Sun Jan 18 09:20:26 EST 2009 | davef
We're not sure of the condition of your solder paste. So, afte 24 hours, if it's: * Unused, in a reclosed container, maybe a week of life depending on the environment * Used, scrap A simple coalescence test can quickly determine the condition of sol
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef
Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot
Electronics Forum | Wed Jun 12 22:35:03 EDT 2002 | jkhiew
We had alot of problem with melf diode short together after reflow soldering. The clearance is about 0.8mm & we used "v" shaped opening . PLease comment !
