Electronics Forum | Thu Nov 25 20:28:43 EST 1999 | cklau
hello, One way to prevent copper land delamination is to applied Anchoring spurs also referred to as "tie-down tabs" or "rabbit ears".These are a metal projection around a land.This features is fully captured by the cover lay (cover coat) that is n
Electronics Forum | Fri Feb 14 17:25:17 EST 2003 | mikeo
Hello, As an Ex-Sanyo engineer I agree with the previous reply. Use EP1 sparingly. You may find that the nozzle sleeves are scored when you remove them. This is from lack of cleaning. You can only buy the sleeve and bearing from sanyo which is a was
Electronics Forum | Wed Dec 26 16:52:57 EST 2012 | davef
"Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework" Author: Brook Sandy, Edward Briggs and Ronald Lasky, Ph.D. Abstract: The increased function of personal electronic devices, such as mobile phones and personal mus
Electronics Forum | Thu Nov 07 15:06:11 EST 2013 | hegemon
1st X-Ray looks pretty good. One instance of what looks like solder migration in the lower left quadrant. 2nd X-Ray shows a number of locations where the solder has migrated into the vias, shown by the small dark circles between the main spheres.
Electronics Forum | Tue Aug 01 09:56:22 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Wed Aug 09 09:43:31 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Mon Oct 21 22:15:36 EDT 2002 | davef
First, SIR data is heavily dependant on the test pattern selected. Be very careful when comparing the results of resistance readings taken from different geometric patterns. Second, if yer talkin': * Bare boards, yupper. * Finished assemblies impor
Electronics Forum | Wed Apr 07 11:53:59 EDT 1999 | Dave F
| Could somebody send me some information about the SMT Beginning? | I mean, when, where, why, SMT starts. | | Thank you, | | Roberto. | Roberto: There�s lots of reasons for getting into SMT. Some of which follow: 1 Manufacturing engineers thi
Electronics Forum | Wed Apr 07 12:54:13 EDT 1999 | Roberto Cardozo
| | Could somebody send me some information about the SMT Beginning? | | I mean, when, where, why, SMT starts. | | | | Thank you, | | | | Roberto. | | | Roberto: There�s lots of reasons for getting into SMT. Some of which follow: | | 1 Manufac
Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler
I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.
