Electronics Forum | Thu Jan 31 13:19:28 EST 2002 | dason_c
What is the baking time/temperature standard for the PCBA before BGA rework?
Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
Electronics Forum | Wed Sep 13 09:15:19 EDT 2006 | Rob
Hi Peter, Out of the 1.5 billion components we shipped last year, we had 3 components back for solderability issues. All 3 had been taken out of their vacuum packaging and left to oxidize for a number of weeks. We don't see it as an issue, but we
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Tue Apr 23 14:39:49 EDT 2002 | mkallen
Here's a related question: How hot can a PBGA get before popcorn delamination becomes a concern? 100 C? 150C? I realize that the answer will depend upon the conditioning of the part, so let's assume that the part is saturated with moisture. A pra
Electronics Forum | Tue Apr 23 16:46:14 EDT 2002 | retronix
I would sugest the lowere the baking temperature the better, the main cause of popcorning is the water expansion and this is greatest as the water boils, 100 degrees, better to elongate the time. Matt
Electronics Forum | Thu Apr 25 09:34:24 EDT 2002 | fmonette
Michael, By the way, the default bake duration should be 48 hours at 125C instead of 24 hours. The shorter duration was based on a standard that is now obsolete. The current revision of J-STD-033 includes a variable duration bake table, based on co
Electronics Forum | Tue Apr 23 18:34:45 EDT 2002 | mkallen
My first posting was not very clear -- sorry. Let me try again. What I want to know is: can I eliminate the drying (baking) process completely IF I know that the good parts (i.e., those not being reworked) are going to stay under some threshold tem
Electronics Forum | Wed Feb 06 20:08:24 EST 2002 | dason_c
Francois/Sleech, thank you very much for your information, by the way where I can get the copy of the paper, what is LTVP stand for and what is the drying requirement expected ie less than 5%? I am also trying to run my evaluation to dry the parts a
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