Electronics Forum: nelco material (Page 2 of 2)

FR4 boards Delamination Cause?

Electronics Forum | Thu May 08 12:11:30 EDT 2008 | boardhouse

Hi Wayne, I am just curious what material is being called out. Are you just specing FR4 or are you calling out a particular IPC 4101 / Some recommended laminates designed for Lead free assembly are: Isola 370HR Nelco 4000-11 or 4000-29 Iteq IT15

PCB Delamination

Electronics Forum | Thu Jan 31 18:14:40 EST 2008 | boardhouse

Hi Felix, First thing to verify is that your supplier is actually suppling you with the correct material. China is known for not keeping with the requested materials and will substitute if not controlled. I would recomend ITEQ, TUC or Nan ya for of

BGA Voiding for RoHS

Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman

Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing

Requesting thermo-elastic Epoxy/E-glass laminate/prepreg materia

Electronics Forum | Wed Oct 29 06:17:45 EDT 2014 | julianf

As stated in the title I would like to know the thermo-elastic material properties, most preferably the E-modulus and CTE in x- and y-direction, for Epoxy/E-glass laminates and/or prepregs for various fibreglass cloth styles. Datasheets only give ro

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