Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost
that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that
Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith
I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic
We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Sat Oct 03 07:26:01 EDT 2009 | cflames17
Check the reference plate on the hydra to make sure it is not cracked or delaminated. I have had problems with the glue coming loose and the plate flapping causing this same problem. check hydra camera calibrations, this to may help.
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
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