Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler
I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.
Electronics Forum | Fri Oct 26 17:01:52 EDT 2001 | davef
We process no Teflon boards. Companies, such as Rogers and Taconic, make laminates of Polytetrafluoroethylene [PTFE] er �Teflon�. Common �Teflon� laminates are: * Woven glass / PTFE * Random microfiber glass / PTFE * Ceramic / PTFE * Woven glass /
Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr
Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while
Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon
| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,
Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours
| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .
Electronics Forum | Thu Apr 16 13:50:49 EDT 1998 | Lou
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Thu Apr 16 13:47:36 EDT 1998 | Lou
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng