Electronics Forum: oval (Page 2 of 4)

Re: Cooling racks

Electronics Forum | Thu Sep 21 20:41:19 EDT 2000 | Dave F

Many moons ago, at another company, we bolted an oval "carousel" to the ceiling. In our case, the carousel was use to convey wave soldering pallets from the end of a in-line washer to the from-end of the wave soldering machine. The pallets hung fro

Need a BGA warpage spec.

Electronics Forum | Wed Jan 13 17:08:20 EST 1999 | Jim Nunns

I have some BGAs with a warped chip carrier. Some of the balls are tall like columns and some are short oval shapes. How can I determine when warpage will cuase failures from stress. Is there a spec out there from studies anyone has done? Any commen

Stencil design (maybe old) question...

Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70

Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu

Solder Balls-No Clean Paste

Electronics Forum | Tue Aug 17 12:27:48 EDT 2010 | namruht

That reminds me...We already have home plate apertures on our stencil. Try number 2...I tried an overall reduction based on the copper layer of 10% and used oval apertures. I hope that you guys can suggest something that I am over looking. I know tha

TO-220 Chip Package - Bridges

Electronics Forum | Wed Jun 12 17:05:41 EDT 2013 | danselness

DeanM - thank you for your response. I will work on uploading a picture of the bridges. We are focusing our efforts on nine boards that use the TO-220 package. I will also pass along your idea of Oval Pads to our Manufacturing and Design Engineers

Re: How to do with tombstoning for component '0402'

Electronics Forum | Thu Nov 02 09:45:00 EST 2000 | bierleinb

I would check trace-pad interactions as you may be robbing heat from one of the pads causing uneven heating during reflow. Also, measure paste deposits on trouble parts to see volume depsoted across the pads. You should easily be able to do 0402s w

Wave Soldering 0.050 pitch connector

Electronics Forum | Wed Oct 25 13:42:32 EDT 2000 | Chris McDonald

I was wondering IF anybody has has success wave soldering a 50 (2 rows of 25) pin 0.050" pitch thru-hole connector. I seem to be getting alot of bridging no matter what I do. Is there a design spec for the size and shape of pads? The pads on the pcb

BGA warpage

Electronics Forum | Wed Jan 13 19:13:59 EST 1999 | Michael Allen

Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype" line at our component supplier's lab (non-production overmold material was used). Production parts have not exhibite

Pick & place nozzle for data switch

Electronics Forum | Mon May 25 20:17:56 EDT 2009 | paligora

Hi , we have problems with the pick & place nozzle when assembling data switches on the PCB. The SMT switches have top surface with diameter of 2.6mm and our supplier is suggesting that if we need to replace the current nozzle which has oval suction

PCB Delamination in PTH hole

Electronics Forum | Tue Oct 27 16:22:00 EDT 2009 | davef

It's not the first thing we think of in looking at your picture. First off, the lack of copper in the region of the red oval makes us think of a plating defect. We don't expect that moisture out-gassing through the barrel wall to show-up on opposite

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