Electronics Forum: package on package soldering (Page 2 of 111)

Gerber editing package

Electronics Forum | Mon Jul 10 09:28:20 EDT 2000 | George English

I am looking to purchase an inexpensive gerber editing package. Does anyone have any ideas. It will be primarily used for the design of solder paste and adhesive stencils.

Heatsink for DPAK package

Electronics Forum | Thu Jun 05 00:00:09 EDT 2003 | Jacky

Hi, Can anyone tell me where I can get heatsinks for DPAK devices? It will be used for cooling IGBTs. Preferably, the heatsink device should be soldered for easy production. Thanks alot.

Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik

Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads

Wavesoldering of PLCC44 package

Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik

Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads

solder question on crystal in DFN style package

Electronics Forum | Mon Apr 05 22:52:40 EDT 2010 | davef

Sounds like you're not getting the solder connection hot enough. Talk about: * Temperature of the solder on the connection * Solder alloy * Board solderability protection * Component solderability protection

solder question on crystal in DFN style package

Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist

We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X

solder question on crystal in DFN style package

Electronics Forum | Mon Apr 05 21:46:12 EDT 2010 | isd_jwendell

I have been using this series with AIM SnPb no-clean paste without problems.

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Component solderability problems TO263 package

Electronics Forum | Fri Aug 04 04:26:31 EDT 2000 | Charles stringer

I am experiencing a problem when soldering down a TO263 package. The device has a large solderable tab (approx 8mm square)on the back and 5 leads. Sometimes the leads are not soldered to the board properly. I am using a metal mask with 9 "windows" of

Stencil apertures for SOT639-2 package

Electronics Forum | Mon Feb 19 10:04:21 EST 2007 | realchunks

It's a nasty little part, but usuallu solders well. Now your inspectors will thing it's not soldered and try and touch it up, but generally, the exposed leads are not tinned, and will not toe fillet. If they know this up front they won't over heat


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