Electronics Forum | Fri Aug 22 09:21:21 EDT 2003 | russ
Search the Archives, Dave F I believe posted the formula not to long ago. Russ
Electronics Forum | Mon Aug 13 20:09:34 EDT 2007 | davef
IPC-7351 SMT Footprint Design Guidelines
Electronics Forum | Mon Oct 31 08:47:27 EST 2005 | jdengler
IPC-7351 is the most complete I have found but is still missing some. Look here http://www.ipc.org/contentpage.asp?Pageid=4.6 Jerry
Electronics Forum | Mon Aug 13 18:59:39 EDT 2007 | gary35
Does anyone have a reference book, web site etc. that will define the various options or descriptions with reference to mounting configurations, i.e. BGA, SOT, MLP, MQFP?
Electronics Forum | Thu Aug 16 12:52:41 EDT 2007 | russ
DAVE, Does this '7351 supercede the IPC-SM-782?(surface mount design and land pattern standard) how about IPC-CM-770? (guidelines for printed board component mounting) those are the two that I have? Russ
Electronics Forum | Fri Oct 29 18:24:46 EDT 1999 | B.Smith
JC, We 'had' this problem previously, but eliminated it for good by using the following: (1) Create a procedure for part orientation that follows IPC standards. Give a copy of this procedure to your receiving department, your buyers, as well as all
Electronics Forum | Thu Nov 11 10:51:16 EST 1999 | KenF
Could anyone tell me where I can find some literature/standards describing the dimensions and solder land sizes of all common SMD components available in the market? IPC-SM-782 does provides some but not all. Thanks in advance for any response. Rega
Electronics Forum | Fri Apr 23 14:19:39 EDT 1999 | C.K.
Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these guys.
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman
You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed
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