Electronics Forum | Mon Mar 27 21:09:29 EST 2006 | ms
Thanks Dave I'm not convinced the air is necessarily in the paste from manufacture - suspicious that it may be folding in during the change in direction of the print cycle - or as the paste travels across apertures. It is not necessarily in the fir
Electronics Forum | Tue Jul 18 16:14:45 EDT 2023 | daniel_stanphill
I remember having seen an ad on LinkedIn or somewhere that showed a handheld pen capable of manual deposits even on 0402 and 0.4mm fine pitch pads. I have been trying to search for it today and am seeing some comparable products but nothing that look
Electronics Forum | Mon May 17 15:14:12 EDT 2004 | solderpro
Agree with Joe 100%, we recently brought one in from Malcolm for trial, this company had not practiced viscosity reading or anything in the process, the trail run was a great improvement in print, consistancy, deposition and formation of the solder b
Electronics Forum | Wed Mar 04 15:26:07 EST 2009 | clampron
Hi Jorge, Take a bare board and measure over the same pad. We have had similar issues with a higher deposition than the stencil thickness. In some cases, we have found that the top of the pad was higher than the solder mask. Our inspector uses the b
Electronics Forum | Wed Oct 25 12:38:05 EDT 2000 | Phil
Hi there!! You know what your QA is doing is right, coz by measuring the solder paste height can avoid the following defects: 1.Insufficient solder 2.Short solder or bridging 3.Solder balls SPC monitoring for paste height checking is required
Electronics Forum | Thu Apr 11 04:03:28 EDT 2002 | mwoodall
The Alpha metals Hi Check 500 is used to measure paste deposit thickness. The paste height is found from a micrometer reading determined by focussing a beam of light on a track adjacent to a paste deposit and then onto the solder paste. I've measure
Electronics Forum | Wed Oct 25 10:11:09 EDT 2000 | Wolfgang Busko
Paddesign, aperture size and stencil thickness determine the amount of solder for your joint. Once you have found suitable parameters you need to control the volume of your paste deposit which is influenced by printer settings, paste condition, stenc
Electronics Forum | Thu Oct 08 22:20:44 EDT 1998 | Dave F
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Fri Oct 09 04:08:45 EDT 1998 | Thomas Blesinger
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Thu Feb 23 09:59:09 EST 2006 | SIR
We have an AUREL CS1222 machine to measure the thickness of the solder paste deposited on a bare board by a stencil printer. This device has a laser beam that has to be put on the pad where you want to measure the solder paste thickness. The measure