Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Wed Oct 07 14:55:17 EDT 1998 | Joe P.
| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain
Electronics Forum | Wed Jan 03 23:00:18 EST 2007 | new guy
I'm a new guy in this field. I have a question about solder paste process. Is there any effect to the solderbility if we do a lot of contact to copper pad without using any insulation ( direct to the finger ). Where can i get information about smt pr
Electronics Forum | Mon Mar 24 15:54:36 EDT 2008 | Paul M.
What r u using for fiducials ? fids? pads? thru-holes? video model? What r u using to print the paste? squeege blades? proflow? paste puck? Why r u using Step Mode ?
Electronics Forum | Tue Feb 21 09:19:50 EST 2006 | Chunks
Hi Mark, Not to be condescending, but is your 265 camera in focus? I've seen one instance of this. If it�s not the camera, and you are sure all your other parameters are good, , then poor definition can be from bad snap-off or bad gasketing. Snap
Electronics Forum | Mon Feb 20 20:47:59 EST 2006 | davef
We assume your stencil is clean. So, try: * Reduce stencil separation speed. * Reduce squeegee pressure. If the pressure is not proper, excess number of particles are stuffed into an aperture and inner pressure / friction among particles increase, an
Electronics Forum | Thu Dec 06 08:57:32 EST 2007 | davef
With this small amount of background information on the situation, comments are: * If you let adhesive cure on your stencil, you should not be using Zestron 301. A hammer and chisel is more effective. * Assuming you are not letting the adhesive cure,
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Mon Dec 22 12:14:15 EST 2008 | pcbbuilders
we sometimes have problems with solder paste release. we use a manual stencil printer. does anyone have any thoughts on using two passes of solder paste on the stencil? i have found that running the second pass gives me better deposits on the fine pi
Electronics Forum | Fri Mar 11 04:12:28 EST 2016 | grahamcooper22
Please can any users of the Rheopump or Enclosed Print Head unit tell me what cartridge pressure setting they use when using lead free paste....many thanks Graham
